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d a t a sh eet preliminary speci?cation 2004 may 04 integrated circuits TZA1046 photodiode and amplifier ic for cd and dvd applications
2004 may 04 2 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 contents 1 features 2 applications 3 general description 4 ordering information 5 quick reference data 6 block diagram 7 pinning 8 mode selection 9 mechanical data 10 limiting values 11 characteristics 12 application and test information 12.1 application example 12.2 test mode description 13 package outline 14 soldering 14.1 introduction to soldering surface mount packages 14.2 reflow soldering 14.3 wave soldering 14.4 manual soldering 14.5 suitability of surface mount ic packages for wave and reflow soldering methods 15 additional soldering information 16 data sheet status 17 definitions 18 disclaimers
2004 may 04 3 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 1 features high frequency rf amplifiers power-down mode for standby condition suitable for all cd (785 nm) and dvd (655 nm) read/write applications four high-bandwidth central outputs (a, b, c and d); four satellite outputs (eg, fh, etst and htst) and one high-bandwidth differential rf output (rfp and rfn) internal current clamp and current fold back (power reduction) versatile programmable gain switches (cd/dvd, h/l and r/w) single 5 v supply current outputs for optimum signal transport over flex cable small outline package htsson16t with good positional tolerance. 2 applications cd and dvd read/write applications. 3 general description the TZA1046 is a single optical pick-up ic for read/write systems and is suitable for cd and dvd applications. the device contains eight rf amplifiers for the central and satellite diodes and one differential rf amplifier (rfp and rfn) which handles the sum of the four a, b, c and d central diode signals. programming the gain is a very versatile way to optimize interfacing between the TZA1046 and the preamplifier. the gain can be programmed for cd or dvd media with the gain switch cd/dvd. the h/l switch is a three level switch that can be used to adjust the gain for different dye and phase change media. the third level (high-impedance state) invokes the power-down mode for standby condition. gain switch r/w is used to reduce the gain during writing. during cd-r writing with clipping, the high peak signals for the central and satellite segments are clamped internally and the output currents of the a, b, c, d, e, f, g and h segments are folded back to reduce power consumption. the output currents can be folded back to almost zero, depending on the light power detected. cd-r writing can also be done without clipping for applications where averaging is used. all outputs are current outputs that can supply a maximum of 8 ma. in cd-r write clip mode, the clipping level of the output currents is between 5 ma and 8 ma. the htsson16t package has a low spread on the z tolerance. the z tolerance is measured between the diodes (chip surface) and the bottom of the leads. the diodes have an offset of 54 m m the y direction with respect to the leadframe centre and a tolerance of 50 m m in both x- and y-directions. in normal operation the satellite outputs f and h are combined as one output fh and the satellite outputs e and g are combined as one output eg. in normal mode the etst and htst outputs are not used (high ohmic). when pulling the r/w pin above the supply or is left open the device comes into a testing mode where all four separate satellite channels are directed to the outputs. this mode is used for optical pick-up unit (opu) alignment of the diodes where all satellite channels must be available. 4 ordering information type number package name description version TZA1046tm htsson16t plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; body 6.6 5.2 1.1 mm sot814-1
2004 may 04 4 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 5 quick reference data symbol parameter conditions min. typ. max. unit supplies v dd1 supply voltage front-end 4.5 5.0 5.5 v v dd2 supply voltage back-end 4.5 5.0 5.5 v i dd1 supply current front-end dark conditions; 6-channel mode writing dvd+r - 13 - ma writing cdr clipping - 27 - ma writing dvd+rw or cdr no-clip - 13 - ma writing cdrw - 12 - ma reading dvd - 27 - ma reading cd - 28 - ma reading dvd+rw - 27 - ma reading cdrw - 27 - ma power-down mode - 0.4 - ma i dd2 supply current back-end dark conditions; 6-channel mode writing dvd+r - 5.3 - ma writing cdr clipping - 5.3 - ma writing dvd+rw or cdr no-clip - 5.3 - ma writing cdrw - 5.3 - ma reading dvd - 5.3 - ma reading cd - 5.3 - ma reading dvd+rw - 5.3 - ma reading cdrw - 6.6 - ma power-down mode - 0.1 - ma temperature range t amb ambient temperature 0 - 70 c rf bandwidth b - 3db(cen) bandwidth of central channels a, b, c and d i o = 1.0 ma; 6-channel mode reading dvd 130 165 - mhz reading cd 100 142 - mhz reading dvd+rw 130 162 - mhz reading cdrw 80 124 - mhz b - 3db(rf) bandwidth of differential channels rfp and rfn i o = 1.0 ma reading dvd 130 175 - mhz reading cd 100 130 - mhz reading dvd+rw 130 166 - mhz reading cdrw 80 114 - mhz
2004 may 04 5 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 settling time t st settling time cd-r write mode (all channels); i set > 300 m a; accuracy set level within 5 %; write peak level to set level factor < 50 -- 22 ns cd-rw and dvd+rw write modes (all channels); i set > 100 m a; accuracy set level within 5 %; write peak level to set level factor 2; peak current i o(max) -- 10 ns dvd+r write mode (all channels); i set > 100 m a; accuracy set level within 5 %; write peak level to set level factor 20; peak current i o(max) -- 12 ns phase delay and group delay variation d t d(p)(rf) phase delay variation differential channels rfp and rfn i o = 1.0 ma; f i = 2 to 104 mhz reading dvd - 0.2 - ns reading cd - 0.3 - ns reading dvd+rw - 0.25 - ns reading cdrw - 0.5 - ns d t d(g)(rf) group delay variation differential channels rfp and rfn i o = 1.0 ma; f i = 2 to 104 mhz reading dvd - 0.4 - ns reading cd - 0.6 - ns reading dvd+rw - 0.4 - ns reading cdrw - 1 - ns sensitivity s output current sensitivity values depend on operating mode; see table 1 --- a/w symbol parameter conditions min. typ. max. unit
2004 may 04 6 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 table 1 output current sensitivity; typical values note 1. the sensitivity of the TZA1046 is specified in a/w because it has current outputs. in the application diagram (see fig.6) the resistors of 150 w convert the currents into voltages. the maximum absolute spread is 20 %. mode output current sensitivity (a/w) (1) central satellite differential (rfp and rfn) writing dvd+r with averaging 0.72 1.44 0.27 reading high re?ective dvd media: single layer dvd and dvd+r 21.6 43.2 8.10 writing dvd+rw with averaging 2.88 5.76 1.08 reading low re?ective dvd media: dual layer dvd and dvd+rw 43.2 86.4 16.2 writing cdr with sampling 43.2 86.4 1.08 reading high re?ective cd media 86.4 173 32.4 writing cdr with averaging 1.44 2.88 0.54 writing cdrw with averaging 5.76 11.5 2.16 reading low re?ective cd media: cdrw 173 346 64.8
2004 may 04 7 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 6 block diagram handbook, full pagewidth a v dd2 v dd1 b v dd2 v dd1 c v dd2 v dd1 d v dd2 v dd1 e v dd2 v dd1 v dd1 v dd1 f v dd2 v dd1 g v dd2 v dd1 h coder (1) v dd2 v dd1 TZA1046 1 14 v dd2 3 gnd 6 h/l 12 a 7 b 8 c 2 d 16 etst 10 fh 15 eg cd/dvd 13 r/w 11 9 htst v dd2 v dd2 4 rfp 5 rfn mdb573 fig.1 block diagram. (1) the coder translates the three digital inputs into the appropriate gain level of each amplifier. the limiter is switched to a high level for other modes than the cd-r writing mode for all segment outputs.
2004 may 04 8 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 7 pinning note 1. in test mode all separate satellite signals are available. in normal mode htst and etst are high ohmic, fh is the sum of f and h and eg is the sum of e and g. symbol pin description a 1 central segment output a d 2 central segment output d v dd2 3 supply voltage back-end rfp 4 positive rf output rfn 5 negative rf output gnd 6 ground b 7 central segment output b c 8 central segment output c htst 9 satellite segment output h in test mode; note 1 fh 10 sum of satellite segment f and segment h output, segment f output in test mode; note 1 r/w 11 gain select switch for reading or writing and to select the test mode h/l 12 gain select switch for low re?ective (h/l = 1) and high re?ective (h/l = 0) media cd/dvd 13 gain select switch for cd or dvd v dd1 14 supply voltage front-end eg 15 sum of satellite segment e and segment g output, satellite output g in test mode; note 1 etst 16 segment e output in test mode; note 1 001aaa407 TZA1046tm rfp rfn gnd b c v dd2 d a cd/dvd h/l r/w fh htst v dd1 eg etst terminal 1 index area 4 5 6 7 8 3 2 1 13 12 11 10 9 14 15 16 fig.2 pin configuration.
2004 may 04 9 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 8 mode selection table 2 coder switching note 1. the 8-channel test mode is activated when v i(test-on) or i i(test-on) is applied to pin r/w or if pin r/w is left open. the values of v i(test-on) or i i(test-on) can be found in chapter 11. 9 mechanical data pin level mode r/w h/l cd/dvd 6-channel mode dont care open low power-down low low low writing dvd+r no-clip or averaging mode low low high writing cdr write-clip or sample mode low open high writing cdr no-clip or averaging mode low high low writing dvd+rw no-clip mode; either sampling or averaging mode low high high writing cdrw no-clip mode, either sampling or averaging mode high low low reading dvd+r; dvd-sl high low; open high reading cd and cdr high high low reading dvd+rw; dvd-dl high high high reading cdrw 8-channel test mode; note 1 test mode low low reading dvd+r and dvd-sl low; open high reading cd and cdr high low reading dvd+rw and dvd-dl high high reading cdrw handbook, full pagewidth 50 115 115 145 100 mgu616 150 150 a ef gh b dc 50 fig.3 photodiode configuration. dimensions in m m. space between central segments: < 1 m m. space between satellite segments: < 1 m m.
2004 may 04 10 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 handbook, full pagewidth e detail x see detail x package centre + 54 m m offset 45 1 mgu617 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 x y fig.4 diagram showing position of the photodiode array with respect to the htsson16t package (top view). 45 angle is with respect to the leadframe. not drawn to scale. package window is not shown. 001aaa035 1.50 min 0.3 0.33 0.23 (16 ) 1.00 min rotation tolerance pin 1 mark 3.0 0.12 2.275 0.12 0 1 0.30 0.025 4.55 f 0.1 c 0.1 c fig.5 diagram showing position of the photodiode array with respect to the htsson16t package (top view).
2004 may 04 11 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 10 limiting values in accordance with the absolute maximum rating system (iec 60134). 11 characteristics v dd1 =v dd2 = 2.0 v; pin r/w = low; pin h/l = low; pin cd/dvd = high; v a =v b =v c =v d = 2.0 v; v eg =v fh =v etst =v htst = 2.0 v; v rfp =v rfn = 2.0 v; measured in dark conditions; t amb =25 c; 6-channel mode; unless otherwise speci?ed. symbol parameter min. max. unit v dd1 supply voltage front-end - 0.3 +5.5 v v dd2 supply voltage back-end - 0.3 +5.5 v d v dd1 supply voltage difference with respect to v dd2 v dd2 - 0.3 v dd2 + 0.3 v d v dd2 supply voltage difference with respect to v dd1 v dd1 - 0.3 v dd1 + 0.3 v v n voltage at pins a, b, c, d, etst, fh, eg, htst, rfp and rfn - 0.3 v dd2 + 0.3 v cd/dvd and h/l - 0.3 v dd1 + 0.3 v r/w - 0.3 v dd1 + 2.5 v symbol parameter conditions min. typ. max. unit supplies v dd1 supply voltage front-end note 1 4.5 5.0 5.5 v v dd2 supply voltage back-end note 1 4.5 5.0 5.5 v i dd1 supply current front-end dark conditions; 6-channel mode; note 2 writing dvd+r - 13 - ma writing cdr clipping - 27 - ma writing dvd+rw or cdr no-clip - 13 - ma writing cdrw - 12 - ma reading dvd - 27 - ma reading cd - 28 - ma reading dvd+rw - 27 - ma reading cdrw - 27 - ma power-down mode - 0.4 - ma
2004 may 04 12 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 i dd2 supply current back-end dark conditions; 6-channel mode; note 2 writing dvd+r - 5.3 - ma writing cdr clipping - 5.3 - ma writing dvd+rw or cdr no-clip - 5.3 - ma writing cdrw - 5.3 - ma reading dvd - 5.3 - ma reading cd - 5.3 - ma reading dvd+rw - 5.3 - ma reading cdrw - 6.6 - ma power-down mode - 0.1 - ma temperature range t amb ambient temperature 0 - 70 c central segment output channels: pins a, b, c and d b - 3db bandwidth i o = 1.0 ma writing dvd+r - 172 - mhz writing cdr clipping - 206 - mhz writing dvd+rw or cdr no-clip - 211 - mhz writing cdrw - 125 - mhz reading dvd 130 165 - mhz reading cd 100 142 - mhz reading dvd+rw 130 162 - mhz reading cdrw 80 124 - mhz d t d(p) phase delay variation i o = 1ma; f i = 2 to 104 mhz reading dvd - 0.25 - ns reading cd - 0.15 - ns reading dvd+rw - 0.2 - ns reading cdrw - 0.3 - ns m sens channel matching sensitivity note 3 0 - 5% v o output voltage range 1 - v dd2 - 1v i o output current 0 - 8ma i o(offset) output offset current dark conditions; t amb = 0 to 70 c reading cdrw - 14 - 1.5 +11 m a other modes - 14 - 0.9 +12 m a i o(clip) output current clipping level cd-r writing; note 4 5 - 8ma i n(o) spot noise output current i o = 1.0 ma; f o = 50 mhz; note 5 reading cd - 1.2 - na/ ? hz reading dvd+rw - 0.4 - na/ ? hz reading cdrw - 2.0 - na/ ? hz symbol parameter conditions min. typ. max. unit
2004 may 04 13 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 differential rf outputs channel: pins rfp and rfn b - 3db bandwidth i o = 1.0 ma writing dvd+r - 120 - mhz writing cdr clipping - 205 - mhz writing dvd+rw or cdr no-clip - 375 - mhz writing cdrw - 118 - mhz reading dvd 130 175 - mhz reading cd 100 130 - mhz reading dvd+rw 130 166 - mhz reading cdrw 80 114 - mhz d t d(p) phase delay variation i o = 1.0 ma; f i = 2 to 104 mhz reading dvd - 0.2 - ns reading cd - 0.3 - ns reading dvd+rw - 0.25 - ns reading cdrw - 0.5 - ns d t d(g) group delay variation i o = 1.0 ma; f i = 2 to 104 mhz reading dvd - 0.4 - ns reading cd - 0.6 - ns reading dvd+rw - 0.4 - ns reading cdrw - 1 - ns cmr common mode ripple i o = 2 ma (peak); f o up to 104 mhz; note 6 - 20 -- db v o output voltage range 1 - v dd2 - 1v i o output current 0 - 8ma i o(offset) output offset current dark conditions; t amb = 0 to 70 c pin rfp 7 22 40 m a pin rfn - 7 - 20 - 35 m a pin rfp; reading cdrw 14 43 79 m a pin rfn; reading cdrw - 13 - 39 - 70 m a i n(o) spot noise output current i o = 1.0 ma; f o = 50 mhz; note 5 reading cd - 0.9 - na/ ? hz reading dvd+rw - 0.3 - na/ ? hz reading cdrw - 1.5 - na/ ? hz symbol parameter conditions min. typ. max. unit
2004 may 04 14 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 satellite segment output channels: pins etst, fh, eg and htst; note 7 b - 3db bandwidth i o = 1.0 ma; 6-channel mode writing dvd+r - 93 - mhz writing cdr clipping - 81 - mhz writing dvd+rw or cdr no-clip - 107 - mhz writing cdrw - 66 - mhz reading dvd 10 75 - mhz reading cd 10 61 - mhz reading dvd+rw 10 66 - mhz reading cdrw 10 56 - mhz m sens channel matching sensitivity note 8 0 - 5% v o output voltage range 1 - v dd2 - 1v i o output current 0 - 8ma i o(offset) output offset current dark conditions; t amb = 0 to 70 c reading cdrw - 25 - 417 m a other modes - 23 - 5.4 12 m a i o(clip) current clipping level cd-r writing; note 4 5 - 8ma i n(o) spot noise output current i o = 1.0 ma; f o = 25 mhz; note 5 reading cd - 2.2 - na/ ? hz reading dvd+rw - 0.8 - na/ ? hz reading cdrw - 4.3 - na/ ? hz settling time, all channels; note 9 t st settling time cd-r write mode; i set > 300 m a; accuracy set level within 5%; write peak level to set level factor < 50 -- 22 ns cd-rw and dvd+rw write modes; i set > 100 m a; accuracy set level within 5 %; write peak level to set level factor 2; peak current i o(max) -- 10 ns dvd+r write mode; i set > 100 m a; accuracy set level within 5%; write peak level to set level factor 20; peak current i o(max) -- 12 ns control inputs: pins r/w, h/l and cd/dvd v il low-level input voltage note 10 0 - 0.6 v v ih high-level input voltage note 10 2.5 - v dd1 v z i(pd) pull-down input impedance only pin cd/dvd - 200 - k w symbol parameter conditions min. typ. max. unit
2004 may 04 15 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 notes 1. the supplies are connected internally by diodes. differences between the supply voltages should not exceed 0.3 v. 2. estimated average power consumption (6 channel mode): p=i dd1 v dd1 +i dd2 v dd2 + 11 / 3 i o(rf) v dd2 k 2 - 8 / 3 i o(rf) v ref + (i o(eg) +i o(fh) ) (v dd2 k 1 - v ref ) - 2 i o(rf) 2 r l2 - 16 / 9 i o(rf) 2 r l1 - i o(eg) 2 r l1 - i o(fh) 2 r l1 , where: r l2 is the load resistance on each of the differential rf outputs rfp and rfn and r l1 is the load resistance on all other outputs. k 1 = 1.35 and k 2 = 1.6 for cd-rw reading; k 1 = 1.50 and k 2 = 1.40 for other modes. v ref =v ref1 =v ref2 ; see fig.6. 3. outputs a, b, c, and d: i o = 3 ma output current. definition of matching: 4. the clipping function is active in the cd-r write mode for the segment outputs (not for outputs rfp and rfn) and in the read mode for all outputs. in the read mode, the clipping level is increased above i o(max) . 5. the s/n ratio improves significantly when the sensitivity is lowered. 6. definition: 7. in test mode all channels are active, in normal mode channels eg and fh are active and channels etst and htst are off. 8. outputs etst, fh, eg, and htst: i o = 1.5 ma output current; m sens = 7 % for reading cd-rw, cd-rom, dvd+rw and writing cd-r. definition of matching in normal mode: definition of matching in test mode: 9. the settling time includes the recovery time. 10. pins r/w and h/l are three-level switches. when these pins are left open-circuit two internal resistors (150 k w to gnd and 350 k w to v dd ) will keep them between 1.3 and 1.7 v. 11. the test mode is also activated when the r/w pin is left open-circuit. test mode: pin r/w v i(test-on) input voltage to activate the test mode note 11 v dd1 + 2 - 8v i i(test-on) force current into pin to activate the test mode 800 - 1200 m a sensitivity s output current sensitivity values depend on operating mode; see table 3 --- a/w symbol parameter conditions min. typ. max. unit i o(max) i o(min) C i a i b i c i d +++ () 1 4 -- - ----------------------------------------------------- - 20 i rfp i rfn + i rfp i rfn C ----------------------------- log i omax () i omin () C i fh i eg + () 1 2 -- - --------------------------------------- i o(max) i o(min) C i etst i fh i eg i htst +++ () 1 4 -- - ------------------------------------------------------------------------------- -
2004 may 04 16 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 table 3 output current sensitivity; typical values note 1. the sensitivity of the TZA1046 is specified in a/w because it has current outputs. in the application diagram (see fig.6) the resistors of 150 w convert the currents into voltages. the maximum absolute spread is 20 %. mode output current sensitivity (a/w) (1) central satellite differential (rfp and rfn) writing dvd+r with averaging 0.72 1.44 0.27 reading high re?ective dvd media: single layer dvd and dvd+r 21.6 43.2 8.10 writing dvd+rw with averaging 2.88 5.76 1.08 reading low re?ective dvd media; dual layer dvd and dvd+rw 43.2 86.4 16.2 writing cdr with sampling 43.2 86.4 1.08 reading high re?ective cd media 86.4 173 32.4 writing cdr with averaging 1.44 2.88 0.54 writing cdrw with averaging 5.76 11.5 2.16 reading low re?ective cd media: cdrw 173 346 64.8
2004 may 04 17 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 12 application and test information 12.1 application example an application example for the TZA1046 is shown in fig.6. the satellite segment pins are cross-coupled to be suitable for rewritable applications. handbook, full pagewidth TZA1046 mdb575 1 234 5 rfp rfn 67 8 16 etst 15 14 13 12 h/l cd/dvd v dd r/w 11 10 9 150 w 150 w eg d a v ref1 v ref2 150 w htst 150 w 150 w 150 w 150 w 75 w 75 w 150 w fh b c fig.6 application example.
2004 may 04 18 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 12.2 test mode description alignment of the diodes during opu manufacturing requires the availability of all satellite outputs. in normal mode the f and h channels are combined to a single output fh and the e and g channels are combined to a single output eg. this is done to switch off two channels in the normal mode (application usage) which saves power consumption. for alignment of the diodes each individual satellite output must be available and therefore the TZA1046 can be put in a test mode where all satellite channels are available. the test mode is activated by pulling the r/w digital input pin above the supply (2 to 2.5 v higher than v dd1 ), by forcing an input current into this pin (800 to 1200 m a) or by leaving the pin open-circuit. fig.7 shows the r/w input configuration. handbook, full pagewidth mdb576 1 k w 350 k w 150 k w 100 k w 40 k w 100 k w 300 k w 1 + 1 + 1 11 1 6 k w 100 w gnd r/w input r/w internal 8-channel test mode vdd1 vdd2 3 14 11 6 fig.7 r/w input configuration.
2004 may 04 19 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 13 package outline references outline version european projection issue date iec jedec jeita sot814-1 - - - - - - - - - 03-10-10 03-11-19 htsson16t: plastic thermal enhanced thin shrink small outline package / transparent; no leads; 16 terminals; body 6.6 x 5.2 x 1.1 mm sot814-1 0 2.5 5 mm scale b 18 16 9 y y 1 c c a c c b v m w m e 1 terminal 1 index area terminal 1 index area x unit a max. c b e e h l e 1 y w v mm 1.1 0.5 0.3 0.33 0.23 0.65 4.55 5.4 5.2 d h 5.15 4.95 d 2 min. e 2 min. 0.05 0.05 y 1 0.1 0.1 dimensions (mm are the original dimensions) 0.3 1.50 1.00 d 5.3 5.1 d 1 4.5 4.0 e 6.7 6.5 e 1 4.2 3.7 d h e h d d 1 d 2 e e 1 e 2 b a l e a detail x c
2004 may 04 20 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 14 soldering 14.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. 14.2 re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson-t and ssop-t packages C for packages with a thickness 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2004 may 04 21 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 14.5 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 3. these transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the reflow oven. the package body peak temperature must be kept as low as possible. 4. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 6. wave soldering is suitable for lqfp, tqfp and qfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on flex foil. however, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. the appropriate soldering profile can be provided on request. 9. hot bar or manual soldering is suitable for pmfp packages. 15 additional soldering information reflow peak temperature for TZA1046tm should be no higher than 215 c 5 c. manual soldering for TZA1046tm is not encouraged. in case of touch-up desolder the defective device manually and use reflow soldering for the assembly of the replacing device. package (1) soldering method wave reflow (2) bga, htsson..t (3) , lbga, lfbga, sqfp, ssop..t (3) , tfbga, uson, vfbga not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable (4) suitable plcc (5) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (5)(6) suitable ssop, tssop, vso, vssop not recommended (7) suitable cwqccn..l (8) , pmfp (9) , wqccn..l (8) not suitable not suitable
2004 may 04 22 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 16 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). 17 definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 18 disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 may 04 23 philips semiconductors preliminary speci?cation photodiode and ampli?er ic for cd and dvd applications TZA1046 ics with cd functionality ? purchase of a philips ic with cd functionality does not convey an implied license under any patent right to use this ic in any cd application. a license under the philips cd patents can be obtained via philips intellectual property & standards (internet at url http://www.ip.philips.com; e-mail info.licensing@philips.com). ics with dvd functionality ? purchase of a philips ic with dvd functionality does not convey an implied license under any patent right to use this ic in any dvd application. a license under the philips dvd patents can be obtained via philips intellectual property & standards (internet at url http://www.ip.philips.com; e-mail info.licensing@philips.com).
? koninklijke philips electronics n.v. 2004 sca76 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands r04/01/pp 24 date of release: 2004 may 04 document order number: 9397 750 11525

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